![[Case Studies of Thermal Design and Thermal Design Consulting] Detailed Thermal Design of Circuit Boards](https://image.mono.ipros.com/public/product/image/cb4/2000365745/IPROS3675709052608867824.jpg?w=280&h=280)
[Case Studies of Thermal Design and Thermal Design Consulting] Detailed Thermal Design of Circuit Boards
Printed circuit boards are important heat dissipation pathways! Are you considering the impact of the wiring patterns?
We will introduce examples of thermal design and thermal design consulting. The printed circuit board is an important heat dissipation pathway. For small-sized components, most of the heat escapes through the substrate, so it is essential to accurately model the density of the wiring patterns. Therefore, we propose our thermal design support tool specifically for electronic devices, "FloTHERM." It allows for easy modeling of important wiring patterns as heat dissipation pathways with the necessary detail. The wiring patterns of multilayer boards are pixel-divided, and equivalent thermal conductivities are automatically calculated for each area. [Case Study] ■ Issue: Detailed thermal design of the substrate ■ Proposed Product: Thermal design support tool "FloTHERM" for electronic devices ■ Benefits: Easy modeling of important wiring patterns as heat dissipation pathways with the necessary detail *For more details, please refer to the PDF document or feel free to contact us.
- 企業：IDAJ
- 価格：Other
